According to news on May 9, UMC's mature process capacity continues to be fully loaded, and the pace of deployment of third-generation semiconductors is also accelerating. According to Taiwan media reports, UMC has recently purchased new machines on a large scale, rushing into the third-generation semiconductor manufacturing field of 8-inch wafers, which is more difficult and more economical. It is expected that related equipment will enter the factory in the second half of the year, making UMC among the industry A leading third-generation semiconductor foundry service provider, adding momentum to subsequent profits.
According to the report, Xu Jianhua, the former senior deputy general manager of UMC, after retiring, moved to Hanlei Investment Control and served as the director of Hanlei and Jiajing, two companies under Hanlei Investment Control, and successfully led Hanlei and Jiajing to mass-produce third-generation semiconductors. Products, UMC is now developing third-generation semiconductors with full firepower, entering the more difficult 8-inch field, highlighting the abundant energy of the group.
UMC's previous third-generation semiconductor layout was mainly through reinvesting in Lian Ying to lock in 6-inch GaN products. The main consideration is that there are currently few GaN overall solution providers in the industry. Lian Ying is building a technology platform and has completed Later, the platform will be opened to design company customers to expand the order-receiving niche.
The supply chain revealed that UMC has recently expanded its third-generation semiconductor layout and purchased new etching and thin-film machines by itself. In the direction of wafers, we will try our best to seize the third-generation semiconductor business opportunities.
Liu Qidong, chief financial officer of UMC, responded that the group still focuses on Lian Ying in the development of third-generation semiconductors, while UMC is conducting research and development, but it is indeed cooperating, but the details are inconvenient to disclose.
According to industry analysis, the thickness of the third-generation semiconductor film is thicker than that of general wafer foundries, which can easily lead to wafer bending. Considering the difficulty of the process, the third-generation semiconductors currently developed in the industry are mainly 6 inches.
However, the radius of a 6-inch wafer is 5 cm, and the radius of an 8-inch wafer is 10 cm. Therefore, an 8-inch wafer can produce "a lot more" than a 6-inch wafer. Under the premise of higher economic benefits , UMC has also begun to cut into the field of 8-inch third-generation semiconductors.
With the blooming of new applications such as 5G and electric vehicles, the demand for high-frequency, high-speed computing, and high-speed charging has greatly increased. The third-generation semiconductor with high energy efficiency and low energy consumption has become a popular fried chicken in the market, which also opens up a new profit equation for UMC.
UMC performed well in the first quarter of this year, with a single-quarter gross profit margin that increased by 4.3 percentage points quarter-on-quarter, breaking the 40% mark to 43.4%, and is expected to continue to rise this quarter, showing the benefits of UMC's continuous development of special processes. The third-generation semiconductor layout is made great strides, and the future of UMC's operation can be expected.
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